By Sonia Ben Dhia, Mohamed Ramdani, Etienne Sicard
Electromagnetic Compatibility of built-in Circuits: suggestions for Low Emission and Susceptibility makes a speciality of the electromagnetic compatibility of built-in circuits. the elemental strategies, conception, and an intensive ancient overview of built-in circuit emission and susceptibility are supplied. Standardized dimension equipment are certain via quite a few case reports. EMC versions for the center, I/Os, offer community, and packaging are defined with functions to performed switching noise, sign integrity, near-field and radiated noise. Case stories from various businesses and study laboratories are awarded with in-depth descriptions of the ICs, try set-ups, and comparisons among measurements and simulations. particular instructions for reaching low emission and susceptibility derived from the adventure of EMC specialists are presented.
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Additional info for Electromagnetic Compatibility of Integrated Circuits: Techniques for low emission and susceptibility
Jonghoon (1998) presented the TEM cell measurements of complex processors with and without local decoupling capacitors. This measurement technique is described in details in Chapter 4. The observed benefit of onchip decoupling capacitors was significant (Fig. 2-15). b -;1 0 . 100 Frequency[MHz] 50 300 Figure 2-15. Impact of on-chip and off-chip decoupling capacitance on radiated emissions. 32 Historical Review and State-of-the-Art IC location -7 X axis Figure 2-16. Near-field scanning. Several works were published soon after (Steinecke, 2000; Van Wershoven, 2000) that confirmed that implementing large embedded capacitors, with values from 1 to 50 nF depending on the technologies and the size of the die, was a very efficient way of reducing emissions.
Time-Domain Reflectometry (TDR) was used by (Hauwermeiren, 1992) for the characterization of package behavior at very high frequencies. A simple model based on discrete R, L, C components was proposed for Leadless Chip Carriers (LCC) and Pin Grid Arrays (PGA). His approach wais very close to the one later proposed by the IBIS group for the modeling of packaging. Historical Review and State-of the-Art Figure 2-7. Parasitic commutation of an inverter circuit output (V3) connected to a long wire (Near end V 1, far end V2) acting as a receiving antenna for a field of 2 Vlm.
2 5 . ... .. i. :.. -03 -X ........ -................................ l i...... ---LA.. *-s ~ * ~ : . : ~ : . --.. . . ... .. , ... ,. Q 4 - ... 635 0 03 * : [ . . 8 2 Frequenoy [GHEI Figure 2-10. Response of an operational amplifier to 100 MHz-2 GHz RFI using microwave probing directly on the chip. More recently, Fiori (2002) published a study of radio-interference effects on analog amplifiers, up to 2 GHz. 2 impedance from the measurement equipment to the integrated circuit (Fig.